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Xilinx
| Part Number | XCZU17EG-L2FFVD1760E | Manufacturer | Xilinx |
|---|---|---|---|
| Description | IC FPGA 308 I/O 1760FCBGA | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Quantity Available | 13 pcs | Data sheet | XCZU17EG-L2FFVD1760E.pdf |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) | Speed | 533MHz, 600MHz, 1.3GHz |
| Series | Zynq® UltraScale+™ MPSoC EG | RAM Size | 256KB |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | Peripherals | DMA, WDT |
| Packaging | Tray | Package / Case | 1760-BBGA, FCBGA |
| Operating Temperature | 0°C ~ 100°C (TJ) | Number of I/O | 308 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | Manufacturer Standard Lead Time | 10 Weeks |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Flash Size | - |
| Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5) | Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Architecture | MCU, FPGA |
| FEDEX | www.FedEx.com | From $35.00 basic shipping fee depend on zone and country. |
|---|---|---|
| DHL | www.DHL.com | From $35.00 basic shipping fee depend on zone and country. |
| UPS | www.UPS.com | From $35.00 basic shipping fee depend on zone and country. |
| TNT | www.TNT.com | From $35.00 basic shipping fee depend on zone and country. |
