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Transimpedance amplifiers for 100-800Gbit/s optical comms

There are two parts, which come in flip chip and wire bonding packaging options for deployment in QSFP, QSFP-DD and OSFP optical modules.

“The rapid evolution to single lane 100G and multiple lanes 200G, 400G and 800G connectivity is increasing the demand for high-performance, power-efficient optical components needed to maximize bandwidth density in the cloud data center,” according to the company.

Both devices include RSSI for photo-alignment and power monitoring and I2C control of bandwidth, output amplitude, peaking, LOS, gain and other parameters.


Electronics Weekly has asked Macom more information on these devices.